Argonne National Laboratory
Center for Nanoscale Materials
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Tools & Capabilities

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*Indicates remote operation is available

Nanofabrication and Devices

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  • Post-Processing
    • ADT Dicing Saw*
    • AS-One 150 Rapid Thermal Processor
    • Critical Point Dryer (Leica CPD300)
    • e3511 Plasma Asher
    • Hybond 626 Wire bonder
    • LatticeGear Cleaving Machine
    • SET FC-150 Flip-chip bonder
  • Deposition
  • Ultralow Temperature/Strong Magnetic Field Measurements*
    • BlueFors LD400 Dilution Refrigerator System
    • AMI Superconductor Vector Magnet
  • Inspection and Metrology
    • Bruker FastScan Atomic Force Microscopy (AFM)*
    • Filmetrics f40 Thin Film Analizer*
    • Four Point Probe*
    • K-Space Stress Gauge*
    • Keyence 3D Laser Scanning Confocal Microscope, VK-X1000*
    • Laser Confocal Microscope OLS4100
    • Optical Microscope: Olympus MX-61
    • Potentiostat
    • Scanning Vibrating Electrode: SVET M370
    • Surface Profiler
    • UVISEL Spectroscopic Ellipsometer: Horiba Jobin Yvon
    • Scanning Electron Microscope VEGA 3 (tungsten filament)
  • Lithography
    • Electron Beam Lithography System: JEOL 8100FS*
    • Heidelberg MLA 150 Maskless Lithography*
    • Electron Beam Lithography System: Raith 150*
    • Focused Ion Beam: FEI Nova 600 NanoLab*
    • Interferometric Lithography System
    • Laser Pattern Generator (Microtech LW405, direct write optical lithography)
    • Stepper: ASML PAS 5000 wafer stepper
    • SUSS MA6/BA6: Contact aligner for front side and front-to-back side alignment
    • ThermoFisher Helios Hydra 5 Plasma Focused Ion Beam Milling
    • Wafer priming oven: YES-TA series
  • Wet Chemistry
    • Electroplating (Au, Cu, Fe, Ni, Pt)
    • Selective Wet Chemical Etching
  • Dry Etching
    • Hydrofluoric acid vapor etcher
    • ONTOS Atmospheric Plasma Surface Treatment System
    • Oxford PlasmaPro 100 Cobra, RIE-ICP and ALE
    • PlasmaTherm Deep Reactive Ion Etcher (DRIE) for silicon
    • RIE Oxford ICP etcher (6-inch)
    • RIE March CS-1701, Fluorine Chamber
    • RIE Oxford PlasmaLab 100, Chlorine Chamber
    • RIE Oxford PlasmaLab 100, Fluorine Chamber
    • SAMCO RIE-10NR
    • SPTS uEtch HF Vapor Release tool
    • Xactix X4 xenon difluoride etcher
  • Wear/Friction Measurements
  • POMS: Piezo-optomechanical Spectrometer
  • Adiabatic Demagnetization Refrigerator (ADR)*

Theory and Modeling

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  • Computational Nanoscience Software and Modeling Expertise*
    • BLAST (Bridging Length/Timescales via Atomistic Simulation Toolkit)
    • Dacapo
    • Density-functional-based tight-binding (DFTB)
    • FANTASTX (AI/ML Framework framework to determine atomistic-level structures from multi-modal experimental and theoretical data)
    • GPaw, a real space, grid-based DFT-PAW code
    • Ingrained
    • MPI-based parallel versions of the nanophotonics
    • Time-domain nanophotonics simulation package
    • VASP, ab-initio molecular dynamics calculations
    • Other specialized analysis software or modeling expertise
  • CNM High Performance Computing Cluster (Carbon)*

Nanophotonics & Biofunctional Structures

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  • Agilent 1260 Infinity II High Temperature GPC
  • Centrifuge
    • Beckman Coulter Avanti J-E Centrifuge
    • Beckman Coulter Optima L-100 XP Ultracentrifuge
  • Surface Preparation
    • Harrick Plasma Cleaner
    • UVO Surface Cleaner
  • Visible and near-IR microscopy
    • Lamp illumination
    • Laser illumination
    • Visible detection
    • NEAR-IR detection
    • Cryostat
  • Synthesis
    • Surface modification of nanoparticles
    • Functionalization
    • Quantum Dots
    • Metal nanoparticles
    • Metal oxide nanoparticles
  • Raman spectroscopy
    • Temperature-controlled stage
  • Time-resolved emission spectroscopy (streak camera)
    • Time-correlated single photon counting (TCSPC) spectroscopy (Photon-correlation microscope))
    • TCSPC Microscopy (400-800 nm)
    • Visible and near-IR TCSPC with streak camera
    • Near-IR TCSPC with superconducting nanowire single photon detector
  • Bench-top spectroscopy
    • UV-Visible Absorption
    • Emission (spectrofluorimeter)
    • FTIR Absorption
    • Circular Dichroism
  • Transient absorption spectroscopy
    • Visible probe
    • Near-IR probe
    • THz probe
    • Cryostat
  • Correlation/antibunching measurements
    • Visible (350-800 nm) detection with APD detectors
    • NIR (800 nm - 2 μm) detection with Superconducting nanowire single-photon detectors (SNSPD)
  • enVISion Transient Absorption Spectrometer
  • FLS1000 spectrofluorimeter
  • Isothermal Titration Calorimeter (ITC)
  • MEOS: Magneto-Electro-Optical Spectrometer
  • Electron Paramagnetic Resonance EPR EleXsys 500-E (CW)
  • Pulsed Electron Paramagnetic Resonance EPR EleXsys-II 580
  • Electrochemical Workstation (BASi Epsilon)
  • GC-MS (Agilent 5975C Series GC/MSD)
  • HPLC (Agilent 1260 LC System)
  • ZetaSizer Nano, Malvern (particle size potential)
  • Magneto-optical Microscope
  • Drop Shape Analysis Tool
  • Solar simulator, Oriel
  • Field Emission Scanning Electron Microscope, JEOL JSM-7500F
  • Laser Scanning Confocal Microscope, Zeiss LSM 510 Meta
  • Optical microscope, Zeiss Axio Imager Z1 M Upright
  • Automated Thin Film Solution Processing Robot
  • Ossila Slot-Die Coater
  • Thin film transfer system
  • General wet lab space for sample prep
  • Autoclave
  • Rotary Evaporator
  • Schlenk Lines
  • Solution-Shearing Station
  • Integrated Glove Box System
  • Peptide Synthesizer

Nanoscale Synthesis and Characterization

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  • Agilent Inductively Coupled Plasma Optical Emission spectroscopy (ICP-OES, Bldg 200)
  • Electrical characterization
    • associated high-sensitivity test systems
    • Keithley 4200-SCS/F Semiconductor Parameter Analyzer
  • X-Ray diffractometer (Bruker D8 Discover, point detector, VANTEC-1 linear detector)
    • Bragg-Brentano powder
    • Grazing incidence
    • High resolution four-circle
    • Reciprocal space mapping
    • Reflectivity
    • Rocking curves
  • VT-UHV-atomic force microscope/scanning tunneling microscope (AFM/STM; Omicron VT-AFM XA) (NST-SOP-086.6)*
    • Contact AFM
    • Magnetic force microscopy
    • Non-contact AFM
    • Scanning tunneling spectroscopy
  • Thermal analysis
  • Magnetometry
  • Physical vapor deposition, common loadlock is shared*
  • Scanning probe microscope, Veeco MultiMode 8 (NST-SOP-006.9)
    • PeakForce quantitative nanomechanical mapping
    • PeakForce tapping
    • Fluid imaging
    • Low current scanning tunneling microscopy
    • Magnetic Force
    • Variable temperature imaging (-30 to 250 C)
  • Asylum Cypher-S AFM (NST SOP 290)
  • X-ray diffractometer (Bruker D8 XRD with Eiger2 detector)
  • Bruker Vertex 70 FTIR with Hyperion Microscope (Building 200)
  • Cary 5000 UV-Vis-NIR (Building 200)
  • Langmuir-Blodgett, Kibron MicroTrough X (Building 200)
  • Rheometer, AntonPaar Physica MCR301
  • Rheo-XPCS
  • Spin Coater, Laurell WS-400, not for lithography resist work
  • Synchrotron X-ray Scanning Tunneling Microscopy (B125)
  • Synthesis Lab - inorganic crystals
  • Optical UHV VT STM/AFM (NST-SOP-126.9)
    • Lasers for Optical UHV VT STM/AFM
  • Tube furnaces (1 in.)
  • UV-Vis-NIR spectrometer, Perkin-Elmer Lambda 950
  • Low temperature multimode scanning tunneling microscopy (LT-STM, Createc) (NST-SOP-196.2)
  • Omicron LT-STM (SOP 303)
  • UHV Cryo SFM with 6T magnetic field, Omicron scanning tunneling microscope (NST-SOP-205)
  • SPM Tip Etching
  • West-Bond Wire Bonder*
  • X-ray diffractometer (Bruker D2 Phaser XRD)
  • X-ray diffractometer (Bruker D8 Discover, Eiger 2 R 500K detector)

Electron and X-ray Microscopy

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  • Hard X-ray Nanoprobe
    • Chemical and Structural Nanoimaging
    • Scanning Nanodiffraction
  • Specimen preparation resources (not FIB)
    • Cutting from bulk
    • Grinding/polishing
    • Dimpling
    • Ion-milling
    • Vacuum-coating with gold or carbon
  • Data Analysis
    • Image processing
    • HRTEM image simulation
    • Diffraction pattern simulation
    • XEDS analysis (including spectrum images)
    • EELS analysis (including spectrum images or EFTEM spectrum images)
  • TFS Spectra 200
    • Probe corrected
    • TEM imaging and diffraction
    • STEM imaging (HAADF & DPC)
    • 4D-STEM (EMPAD)
    • XEDS, Super-X, 4SDD EDX system
    • Lorentz TEM imaging
    • Tomography
    • Gatan GIF System
    • Biprism-based holography
  • Hitachi S-4700-II SEM*
    • SEI & BSE imaging (0.5-30 kV)
    • XEDS mapping or spectrum imaging
  • Field Emission Transmission Electron Microscope, JEOL JEM-2100F
    • TEM imaging and diffraction (200 kV)
    • EFTEM imaging (200 kV)
    • EELS (200 kV)
    • XEDS
    • Tomography (200 kV)
    • Special specimen holders
  • Talos F200X (S)TEM
    • TEM imaging and diffraction (80, 120, & 200kV)
    • STEM imaging (HAADF & BF; DF2, DF4, DPC, 80, 120, & 200 kV)
    • XEDS, Super-X, 4SDD EDX system
    • EDS mapping (profiles and/or maps)
    • Lorentz imaging (200 kV)
    • Tomography (200 kV)
  • Zeiss 1540XB FIB-SEM
    • TEM sample preparation
    • 3D FIB-SEM serial sectioning
    • SEI & BSE imaging (in conjunction with FIB cross-sectioning)
  • Ultrafast Electron Microscopy (UEM)
    • Temporal resolution
    • Pump
    • Holders
  • FEI Quanta 400F (E)SEM
    • High-vacuum mode (P < 10-5 torr)
    • Low-vacuum mode (P ~ 0.1-2 torr)
    • ESEM mode (P ~ 2-20 torr)
    • ESEM mode with a gas other than air or water vapor
    • Peltier-cooled stage (T ~ 248-328 K)
    • Heating stages (T < 1273 K or T < 1773 K)
  • JEOL IT800HL SEM